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Comparison of Argon and Oxygen Plasma Treatments for Ambient Room-Temperature Wafer-Scale Au–Au Bonding Using Ultrathin Au Films

Au–Au surface activated bonding is promising for room-temperature bonding. The use of Ar plasma vs. O(2) plasma for pretreatment was investigated for room-temperature wafer-scale Au–Au bonding using ultrathin Au films (<50 nm) in ambient air. The main difference between Ar plasma and O(2) plasma...

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Detalles Bibliográficos
Autores principales: Yamamoto, Michitaka, Matsumae, Takashi, Kurashima, Yuichi, Takagi, Hideki, Suga, Tadatomo, Itoh, Toshihiro, Higurashi, Eiji
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6412855/
https://www.ncbi.nlm.nih.gov/pubmed/30781779
http://dx.doi.org/10.3390/mi10020119