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Comparison of Argon and Oxygen Plasma Treatments for Ambient Room-Temperature Wafer-Scale Au–Au Bonding Using Ultrathin Au Films
Au–Au surface activated bonding is promising for room-temperature bonding. The use of Ar plasma vs. O(2) plasma for pretreatment was investigated for room-temperature wafer-scale Au–Au bonding using ultrathin Au films (<50 nm) in ambient air. The main difference between Ar plasma and O(2) plasma...
| Autores principales: | , , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2019
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6412855/ https://www.ncbi.nlm.nih.gov/pubmed/30781779 http://dx.doi.org/10.3390/mi10020119 |