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Epoxy-Thiol Systems Filled with Boron Nitride for High Thermal Conductivity Applications

An epoxy-thiol system filled with boron nitride (BN), in the form of 80 µm agglomerates, has been investigated with a view to achieving enhanced thermal conductivity. The effect of BN content on the cure reaction kinetics has been studied by differential scanning calorimetry (DSC) and the thermal co...

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Detalles Bibliográficos
Autores principales:	Hutchinson, John M., Román, Frida, Folch, Adrià
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2018
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6414828/ https://www.ncbi.nlm.nih.gov/pubmed/30966375 http://dx.doi.org/10.3390/polym10030340

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