Conformal hexagonal-boron nitride dielectric interface for tungsten diselenide devices with improved mobility and thermal dissipation

Relatively low mobility and thermal conductance create challenges for application of tungsten diselenide (WSe(2)) in high performance devices. Dielectric interface is of extremely importance for improving carrier transport and heat spreading in a semiconductor device. Here, by near-equilibrium plasm...

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Detalles Bibliográficos
Autores principales: Liu, Donghua, Chen, Xiaosong, Yan, Yaping, Zhang, Zhongwei, Jin, Zhepeng, Yi, Kongyang, Zhang, Cong, Zheng, Yujie, Wang, Yao, Yang, Jun, Xu, Xiangfan, Chen, Jie, Lu, Yunhao, Wei, Dapeng, Wee, Andrew Thye Shen, Wei, Dacheng
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6416324/
https://www.ncbi.nlm.nih.gov/pubmed/30867418
http://dx.doi.org/10.1038/s41467-019-09016-0

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