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A Computational Thermodynamics-Assisted Development of Sn-Bi-In-Ga Quaternary Alloys as Low-Temperature Pb-Free Solders

Low-temperature lead (Pb)-free solders are demanding in the electronic packaging industry, because it would open the door for various economic choices of polymeric materials as substrates and also revives the lower cost processes. Here, we proposed a tin–bismuth–indium–gallium (Sn-52.5Bi-2.68In-1Ga,...

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Autores principales: Yang, Chih-han, Zhou, Shiqi, Lin, Shih-kang, Nishikawa, Hiroshi
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6416625/
https://www.ncbi.nlm.nih.gov/pubmed/30791585
http://dx.doi.org/10.3390/ma12040631
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author Yang, Chih-han
Zhou, Shiqi
Lin, Shih-kang
Nishikawa, Hiroshi
author_facet Yang, Chih-han
Zhou, Shiqi
Lin, Shih-kang
Nishikawa, Hiroshi
author_sort Yang, Chih-han
collection PubMed
description Low-temperature lead (Pb)-free solders are demanding in the electronic packaging industry, because it would open the door for various economic choices of polymeric materials as substrates and also revives the lower cost processes. Here, we proposed a tin–bismuth–indium–gallium (Sn-52.5Bi-2.68In-1Ga, SBIG (in wt.%)) quaternary low-temperature solder, designed based on systematic CALPHAD (CALculation of PHAse Diagram)-type thermodynamic calculations and corresponding key experiments. The solidification behavior of SBIG was carefully elaborated based on the computations using the lever rule and the Scheil model, and the experiments in terms of thermal analyses and microstructures of sample produced with step-quenching and various cooling rates. The mechanical properties of as-cast and 80 °C-annealed SBIG as well as their microstructures and fracture surfaces were evaluated in the tensile tests. The proposed SBIG solder is with a low liquidus temperature of 141.9 °C and is typically composed of the primary (Sn) phase, the (Sn) + (Bi) eutectic structure and a small amount of (Ga) phase. Air cooling has been identified as a satisfactory cooling rate, which would not lead to the formation of the brittle BiIn intermetallic compound. The as-cast SBIG solder exhibited high yield strength (YS) of 43.7 MPa, high ultimate tensile strength (UTS) of 53.3 MPa and an extremely large elongation of 97.3% as comparing to the conventional eutectic Sn-58Bi solder (YS: 43.1 MPa, UTS: 49.5 MPa, and elongation: 37.5%). However, the proposed SBIG solder does not possess qualified thermal stability, that significant degradation in both strength and elongation were observed after being subjected to extensive thermal ageing at 80 °C for 504 h.
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spelling pubmed-64166252019-03-29 A Computational Thermodynamics-Assisted Development of Sn-Bi-In-Ga Quaternary Alloys as Low-Temperature Pb-Free Solders Yang, Chih-han Zhou, Shiqi Lin, Shih-kang Nishikawa, Hiroshi Materials (Basel) Article Low-temperature lead (Pb)-free solders are demanding in the electronic packaging industry, because it would open the door for various economic choices of polymeric materials as substrates and also revives the lower cost processes. Here, we proposed a tin–bismuth–indium–gallium (Sn-52.5Bi-2.68In-1Ga, SBIG (in wt.%)) quaternary low-temperature solder, designed based on systematic CALPHAD (CALculation of PHAse Diagram)-type thermodynamic calculations and corresponding key experiments. The solidification behavior of SBIG was carefully elaborated based on the computations using the lever rule and the Scheil model, and the experiments in terms of thermal analyses and microstructures of sample produced with step-quenching and various cooling rates. The mechanical properties of as-cast and 80 °C-annealed SBIG as well as their microstructures and fracture surfaces were evaluated in the tensile tests. The proposed SBIG solder is with a low liquidus temperature of 141.9 °C and is typically composed of the primary (Sn) phase, the (Sn) + (Bi) eutectic structure and a small amount of (Ga) phase. Air cooling has been identified as a satisfactory cooling rate, which would not lead to the formation of the brittle BiIn intermetallic compound. The as-cast SBIG solder exhibited high yield strength (YS) of 43.7 MPa, high ultimate tensile strength (UTS) of 53.3 MPa and an extremely large elongation of 97.3% as comparing to the conventional eutectic Sn-58Bi solder (YS: 43.1 MPa, UTS: 49.5 MPa, and elongation: 37.5%). However, the proposed SBIG solder does not possess qualified thermal stability, that significant degradation in both strength and elongation were observed after being subjected to extensive thermal ageing at 80 °C for 504 h. MDPI 2019-02-20 /pmc/articles/PMC6416625/ /pubmed/30791585 http://dx.doi.org/10.3390/ma12040631 Text en © 2019 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Yang, Chih-han
Zhou, Shiqi
Lin, Shih-kang
Nishikawa, Hiroshi
A Computational Thermodynamics-Assisted Development of Sn-Bi-In-Ga Quaternary Alloys as Low-Temperature Pb-Free Solders
title A Computational Thermodynamics-Assisted Development of Sn-Bi-In-Ga Quaternary Alloys as Low-Temperature Pb-Free Solders
title_full A Computational Thermodynamics-Assisted Development of Sn-Bi-In-Ga Quaternary Alloys as Low-Temperature Pb-Free Solders
title_fullStr A Computational Thermodynamics-Assisted Development of Sn-Bi-In-Ga Quaternary Alloys as Low-Temperature Pb-Free Solders
title_full_unstemmed A Computational Thermodynamics-Assisted Development of Sn-Bi-In-Ga Quaternary Alloys as Low-Temperature Pb-Free Solders
title_short A Computational Thermodynamics-Assisted Development of Sn-Bi-In-Ga Quaternary Alloys as Low-Temperature Pb-Free Solders
title_sort computational thermodynamics-assisted development of sn-bi-in-ga quaternary alloys as low-temperature pb-free solders
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6416625/
https://www.ncbi.nlm.nih.gov/pubmed/30791585
http://dx.doi.org/10.3390/ma12040631
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