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A Smart Epoxy Composite Based on Phase Change Microcapsules: Preparation, Microstructure, Thermal and Dynamic Mechanical Performances

Microencapsulated phase change materials (MicroPCMs)-incorporated in epoxy composites have drawn increasing interest due to their promising application potential in the fields of thermal energy storage and temperature regulation. However, the study on the effect of MicroPCMs on their microstructure,...

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Autores principales: Hu, Qinghong, Chen, Yan, Hong, Jiaoling, Jin, Shan, Zou, Guangjin, Chen, Ling, Chen, Da-Zhu
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6429137/
https://www.ncbi.nlm.nih.gov/pubmed/30845646
http://dx.doi.org/10.3390/molecules24050916
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author Hu, Qinghong
Chen, Yan
Hong, Jiaoling
Jin, Shan
Zou, Guangjin
Chen, Ling
Chen, Da-Zhu
author_facet Hu, Qinghong
Chen, Yan
Hong, Jiaoling
Jin, Shan
Zou, Guangjin
Chen, Ling
Chen, Da-Zhu
author_sort Hu, Qinghong
collection PubMed
description Microencapsulated phase change materials (MicroPCMs)-incorporated in epoxy composites have drawn increasing interest due to their promising application potential in the fields of thermal energy storage and temperature regulation. However, the study on the effect of MicroPCMs on their microstructure, thermal and viscoelastic properties is quite limited. Herein, a new type of smart epoxy composite incorporated with polyurea (PU)-shelled MicroPCMs was fabricated via solution casting method. Field emission-scanning electron microscope (FE-SEM) images revealed that the MicroPCMs were uniformly distributed in the epoxy matrix. The thermal stabilities, conductivities, phase change properties, and dynamic mechanical behaviors of the composite were studied by differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), dynamic mechanical analysis (DMA), thermal constant analyzer and infrared thermography. The results suggested that the heat storage ability of the composites was improved by increasing the MicroPCMs content. The thermal stability of MicroPCMs was found to be enhanced after incorporation into the matrix, and the MicroPCMs-incorporated epoxy composites showed a good thermal cycling reliability. Moreover, the incorporation of MicroPCMs reduced the composites’ storage modulus but increased the glass transition temperature (T(g)) as a result of their restriction to the chain motion of epoxy resin. Besides, a less marked heating effect for the composite was explored through infrared thermography analysis, demonstrating the good prospect for temperature regulation application.
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spelling pubmed-64291372019-04-15 A Smart Epoxy Composite Based on Phase Change Microcapsules: Preparation, Microstructure, Thermal and Dynamic Mechanical Performances Hu, Qinghong Chen, Yan Hong, Jiaoling Jin, Shan Zou, Guangjin Chen, Ling Chen, Da-Zhu Molecules Article Microencapsulated phase change materials (MicroPCMs)-incorporated in epoxy composites have drawn increasing interest due to their promising application potential in the fields of thermal energy storage and temperature regulation. However, the study on the effect of MicroPCMs on their microstructure, thermal and viscoelastic properties is quite limited. Herein, a new type of smart epoxy composite incorporated with polyurea (PU)-shelled MicroPCMs was fabricated via solution casting method. Field emission-scanning electron microscope (FE-SEM) images revealed that the MicroPCMs were uniformly distributed in the epoxy matrix. The thermal stabilities, conductivities, phase change properties, and dynamic mechanical behaviors of the composite were studied by differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), dynamic mechanical analysis (DMA), thermal constant analyzer and infrared thermography. The results suggested that the heat storage ability of the composites was improved by increasing the MicroPCMs content. The thermal stability of MicroPCMs was found to be enhanced after incorporation into the matrix, and the MicroPCMs-incorporated epoxy composites showed a good thermal cycling reliability. Moreover, the incorporation of MicroPCMs reduced the composites’ storage modulus but increased the glass transition temperature (T(g)) as a result of their restriction to the chain motion of epoxy resin. Besides, a less marked heating effect for the composite was explored through infrared thermography analysis, demonstrating the good prospect for temperature regulation application. MDPI 2019-03-06 /pmc/articles/PMC6429137/ /pubmed/30845646 http://dx.doi.org/10.3390/molecules24050916 Text en © 2019 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Hu, Qinghong
Chen, Yan
Hong, Jiaoling
Jin, Shan
Zou, Guangjin
Chen, Ling
Chen, Da-Zhu
A Smart Epoxy Composite Based on Phase Change Microcapsules: Preparation, Microstructure, Thermal and Dynamic Mechanical Performances
title A Smart Epoxy Composite Based on Phase Change Microcapsules: Preparation, Microstructure, Thermal and Dynamic Mechanical Performances
title_full A Smart Epoxy Composite Based on Phase Change Microcapsules: Preparation, Microstructure, Thermal and Dynamic Mechanical Performances
title_fullStr A Smart Epoxy Composite Based on Phase Change Microcapsules: Preparation, Microstructure, Thermal and Dynamic Mechanical Performances
title_full_unstemmed A Smart Epoxy Composite Based on Phase Change Microcapsules: Preparation, Microstructure, Thermal and Dynamic Mechanical Performances
title_short A Smart Epoxy Composite Based on Phase Change Microcapsules: Preparation, Microstructure, Thermal and Dynamic Mechanical Performances
title_sort smart epoxy composite based on phase change microcapsules: preparation, microstructure, thermal and dynamic mechanical performances
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6429137/
https://www.ncbi.nlm.nih.gov/pubmed/30845646
http://dx.doi.org/10.3390/molecules24050916
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