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Ammoxidized Fenton-Activated Pine Kraft Lignin Accelerates Synthesis and Curing of Resole Resins
Ammoxidation of pine kraft lignin in aqueous 5 wt % ammonia affords a novel type of phenol substitute that significantly accelerates resole synthesis and curing as demonstrated for 40 wt % phenol replacement. Compared to non-ammoxidized lignin, which already shortens significantly the cooking time r...
Autores principales: | , , , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2017
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6432072/ https://www.ncbi.nlm.nih.gov/pubmed/30970720 http://dx.doi.org/10.3390/polym9020043 |
Sumario: | Ammoxidation of pine kraft lignin in aqueous 5 wt % ammonia affords a novel type of phenol substitute that significantly accelerates resole synthesis and curing as demonstrated for 40 wt % phenol replacement. Compared to non-ammoxidized lignin, which already shortens significantly the cooking time required to reach a resole viscosity of 1000 Pa·s (250 vs. 150 s) and reduces the typical curing B-time by about 25% at 100 °C, the use of ammoxidized lignin has an even more pronounced impact in this respect. Activation of lignin by Fenton-type oxidation prior to ammoxidation further boosts both synthesis and curing of the resole. This is presumably due to the intermediary formation of polyvalent cross-linkers like N,N,N-tris (methylol) trimethylene triamine triggered by saponification of a larger fraction of nitrogenous moieties present in such a treated lignin (ammonium salts, amide-type nitrogen, urea) and reaction of the released ammonia with formaldehyde. Except for the fact that phenol replacement by ammoxidized lignin results in a somewhat less brittle cured adhesive polymer and higher elastic modulus, the aforementioned acceleration in curing could no longer be observed in the presence of wood, where a significantly delayed wood-adhesive bond formation was observed for the lignin-containing adhesives as evident from the automated bonding evaluation system. |
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