High Bonding Temperatures Greatly Improve Soy Adhesive Wet Strength

Soy wood adhesive bond strengths reported in different literature studies are difficult to compare because a variety of temperatures and other conditions have been used for the bonding and testing step. Some reports have indicated bond strengths are sensitive to bonding temperature, but the reason(s...

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Detalles Bibliográficos
Autores principales: Frihart, Charles R., Coolidge, Thomas, Mock, Chera, Valle, Eder
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2016
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6432081/
https://www.ncbi.nlm.nih.gov/pubmed/30974668
http://dx.doi.org/10.3390/polym8110394

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6432081/
https://www.ncbi.nlm.nih.gov/pubmed/30974668
http://dx.doi.org/10.3390/polym8110394

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