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High Bonding Temperatures Greatly Improve Soy Adhesive Wet Strength
Soy wood adhesive bond strengths reported in different literature studies are difficult to compare because a variety of temperatures and other conditions have been used for the bonding and testing step. Some reports have indicated bond strengths are sensitive to bonding temperature, but the reason(s...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2016
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6432081/ https://www.ncbi.nlm.nih.gov/pubmed/30974668 http://dx.doi.org/10.3390/polym8110394 |