Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn–Ag–Cu Solder on a Cu Substrate

This study investigated the suppression of the growth of the intermetallic compound (IMC) layer that forms between epoxy solder joints and the substrate in electronic packaging by adding graphene nano-sheets (GNSs) to 96.5Sn–3.0Ag–0.5Cu (wt %, SAC305) solder whose bonding characteristics had been st...

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Detalles Bibliográficos
Autores principales: Kang, Min-Soo, Kim, Do-Seok, Shin, Young-Eui
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6471036/
https://www.ncbi.nlm.nih.gov/pubmed/30901825
http://dx.doi.org/10.3390/ma12060936

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6471036/
https://www.ncbi.nlm.nih.gov/pubmed/30901825
http://dx.doi.org/10.3390/ma12060936

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