High Precision Thermoforming 3D-Conformable Electronics with a Phase-Changing Adhesion Interlayer

Modern design-conscious products have raised the development of advanced electronic fabricating technologies. These widely used industrial technologies show high compatibility for inorganic materials and capacity for mass production. However, the morphology accuracy is hard to ensure and cracks happ...

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Detalles Bibliográficos
Autores principales: Wu, Kang, Zhou, Qifeng, Zou, Huaping, Leng, Kangmin, Zeng, Yifan, Wu, Zhigang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6471248/
https://www.ncbi.nlm.nih.gov/pubmed/30813578
http://dx.doi.org/10.3390/mi10030160

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6471248/
https://www.ncbi.nlm.nih.gov/pubmed/30813578
http://dx.doi.org/10.3390/mi10030160

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