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Effect of Aluminum Addition on the Microstructure and Properties of Non-Eutectic Sn-20Bi Solder Alloys

This study investigates the effect of aluminum (Al) on the microstructure, micro-hardness, and wettability of environmentally friendly Sn-20Bi-xAl (x = 0, 0.1, 0.3, 0.5 (wt.%)) solder alloys. Scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS) analysis, and X-ray diffraction...

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Detalles Bibliográficos
Autores principales:	Yang, Wenchao, Li, Jidong, Li, Yitai, Feng, Junli, Wu, Jingwu, Zhou, Xiankun, Yu, Aihua, Wang, Jiahui, Liang, Siyu, Wei, Mei, Zhan, Yongzhong
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2019
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6480923/ https://www.ncbi.nlm.nih.gov/pubmed/30979091 http://dx.doi.org/10.3390/ma12071194

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