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Impact of Solvent Evaporation and Curing Protocol on Degree of Conversion of Etch-and-Rinse and Multimode Adhesives Systems

OBJECTIVES: This study evaluated the effect of air-drying time and light-curing time on the degree of conversion (DC) of three etch-and-rinse adhesive systems: ONE-STEP (OS) and ONE-STEP plus (OSP), Ambar (AMB), and two multimode adhesive systems: All-Bond Universal (ABU) and ScotchBond Universal (S...

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Detalles Bibliográficos
Autores principales:	Carvalho, Ceci Nunes, Lanza, Marcos Daniel Septímio, Dourado, Letícia Gomes, Carvalho, Edilausson Moreno, Bauer, José
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	Hindawi 2019
Materias:	Research Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6487092/ https://www.ncbi.nlm.nih.gov/pubmed/31097965 http://dx.doi.org/10.1155/2019/5496784

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