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Rheological Properties and Thermal Conductivity of Epoxy Resins Filled with a Mixture of Alumina and Boron Nitride

Electronic packaging materials with high thermal conductivity and suitable viscosity are necessary in the manufacturing of highly integrated electronic devices for efficient heat dissipation during operation. This study looked at the effect of boron nitride (BN) platelets on the rheology and thermal...

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Detalles Bibliográficos
Autores principales:	Mai, Van-Dung, Lee, Dae-Il, Park, Jun-Hong, Lee, Dai-Soo
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2019
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6523155/ https://www.ncbi.nlm.nih.gov/pubmed/30960581 http://dx.doi.org/10.3390/polym11040597

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