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Micro-LEGO for MEMS

The recently developed transfer printing-based microassembly called micro-LEGO has been exploited to enable microelectromechanical systems (MEMS) applications which are difficult to achieve using conventional microfabrication. Micro-LEGO involves transfer printing and thermal processing of prefabric...

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Detalles Bibliográficos
Autor principal: Kim, Seok
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6523840/
https://www.ncbi.nlm.nih.gov/pubmed/31010089
http://dx.doi.org/10.3390/mi10040267
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author Kim, Seok
author_facet Kim, Seok
author_sort Kim, Seok
collection PubMed
description The recently developed transfer printing-based microassembly called micro-LEGO has been exploited to enable microelectromechanical systems (MEMS) applications which are difficult to achieve using conventional microfabrication. Micro-LEGO involves transfer printing and thermal processing of prefabricated micro/nanoscale materials to assemble structures and devices in a 3D manner without requiring any wet or vacuum processes. Therefore, it complements existing microfabrication and other micro-assembly methods. In this paper, the process components of micro-LEGO, including transfer printing with polymer stamps, material preparation and joining, are summarized. Moreover, recent progress of micro-LEGO within MEMS applications are reviewed by investigating several example devices which are partially or fully assembled via micro-LEGO.
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spelling pubmed-65238402019-06-03 Micro-LEGO for MEMS Kim, Seok Micromachines (Basel) Review The recently developed transfer printing-based microassembly called micro-LEGO has been exploited to enable microelectromechanical systems (MEMS) applications which are difficult to achieve using conventional microfabrication. Micro-LEGO involves transfer printing and thermal processing of prefabricated micro/nanoscale materials to assemble structures and devices in a 3D manner without requiring any wet or vacuum processes. Therefore, it complements existing microfabrication and other micro-assembly methods. In this paper, the process components of micro-LEGO, including transfer printing with polymer stamps, material preparation and joining, are summarized. Moreover, recent progress of micro-LEGO within MEMS applications are reviewed by investigating several example devices which are partially or fully assembled via micro-LEGO. MDPI 2019-04-21 /pmc/articles/PMC6523840/ /pubmed/31010089 http://dx.doi.org/10.3390/mi10040267 Text en © 2019 by the author. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Review
Kim, Seok
Micro-LEGO for MEMS
title Micro-LEGO for MEMS
title_full Micro-LEGO for MEMS
title_fullStr Micro-LEGO for MEMS
title_full_unstemmed Micro-LEGO for MEMS
title_short Micro-LEGO for MEMS
title_sort micro-lego for mems
topic Review
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6523840/
https://www.ncbi.nlm.nih.gov/pubmed/31010089
http://dx.doi.org/10.3390/mi10040267
work_keys_str_mv AT kimseok microlegoformems