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Flow behavior, thixotropy, and dynamic viscoelasticity of ethanolic purified basil (Ocimum bacilicum L.) seed gum solutions during thermal treatment
During processing, foodstuffs may be treated at various thermal operations. Thus, this study investigated the functional properties and flow behavior at operation conditions to ensure safety and improve quality and stability at high temperatures and analyzed the ability of gum to be used in food for...
Autores principales: | , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
John Wiley and Sons Inc.
2019
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6526669/ https://www.ncbi.nlm.nih.gov/pubmed/31139375 http://dx.doi.org/10.1002/fsn3.992 |
Sumario: | During processing, foodstuffs may be treated at various thermal operations. Thus, this study investigated the functional properties and flow behavior at operation conditions to ensure safety and improve quality and stability at high temperatures and analyzed the ability of gum to be used in food formulation. The results showed that the purified basil seed gum (PBSG) solutions could beknown as non‐Newtonian liquids with pseudoplastic behavior. Frequency sweep revealed the storage modulus (G′) was higher than the loss modulus (G″) in the treatments. According to stress sweep, frequency sweep, complex viscosity (η (*)), and loss‐tangent (tan δ) outcomes, mechanical spectra of PBSG were categorized as weak gels. Besides, concentration and temperature were effect on G′ and G″. The results indicated that, in general, 1% PBSG‐121°C had the maximum yield stress, consistency coefficient (k), extent of thixotropy, and the minimum values of flow behavior index. Also, 1% PBSG showed the highest G′, G″, η (*), yield stress values at the limit of the LVE range (τ(y)), flow‐point stress (τ(f)), and corresponding modulus G (f) (G′ = G″), and the lowest value of tan δ. Exhibiting distinctive rheological characteristics of PBSG makes it as a worthy hydrocolloid to use in food products, which use thermal processing. |
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