Structure Inheritance in Nanoparticle Ink Direct-Writing Processes and Crack-Free Nano-Copper Interconnects Printed by a Single-Run Approach

When nanoparticle conductive ink is used for printing interconnects, cracks and pores are common defects that deteriorate the electrical conductivity of the printed circuits. Influences of the ink solvent, the solid fraction of the ink, the pre-printing treatment and the sintering parameters on the...

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Detalles Bibliográficos
Autores principales: Liu, Shujie, Li, Yujie, Xing, Songling, Liu, Lei, Zou, Guisheng, Zhang, Peng
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6539478/
https://www.ncbi.nlm.nih.gov/pubmed/31085993
http://dx.doi.org/10.3390/ma12091559

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6539478/
https://www.ncbi.nlm.nih.gov/pubmed/31085993
http://dx.doi.org/10.3390/ma12091559

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