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The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints
A lead-free Sn-2.5Ag-0.7Cu base solder with different weight percentages of bismuth (0, 1, 2.5, 5) was used. Thermal properties, microstructure, wettability and mechanical properties were investigated. By decreasing the degree of undercooling, microstructure improved, the eutectic structure become f...
| Autores principales: | , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
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Nature Publishing Group UK
2019
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6557902/ https://www.ncbi.nlm.nih.gov/pubmed/31182784 http://dx.doi.org/10.1038/s41598-019-44758-3 |