Moiré-Based Alignment Using Centrosymmetric Grating Marks for High-Precision Wafer Bonding

High-precision aligned wafer bonding is essential to heterogeneous integration, with the device dimension reduced continuously. To get the alignment more accurately and conveniently, we propose a moiré-based alignment method using centrosymmetric grating marks. This method enables both coarse and fi...

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Detalles Bibliográficos
Autores principales: Huang, Boyan, Wang, Chenxi, Fang, Hui, Zhou, Shicheng, Suga, Tadatomo
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6563106/
https://www.ncbi.nlm.nih.gov/pubmed/31121955
http://dx.doi.org/10.3390/mi10050339

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6563106/
https://www.ncbi.nlm.nih.gov/pubmed/31121955
http://dx.doi.org/10.3390/mi10050339

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