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Moiré-Based Alignment Using Centrosymmetric Grating Marks for High-Precision Wafer Bonding
High-precision aligned wafer bonding is essential to heterogeneous integration, with the device dimension reduced continuously. To get the alignment more accurately and conveniently, we propose a moiré-based alignment method using centrosymmetric grating marks. This method enables both coarse and fi...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2019
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6563106/ https://www.ncbi.nlm.nih.gov/pubmed/31121955 http://dx.doi.org/10.3390/mi10050339 |