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Electrical Properties of Thiol-ene-based Shape Memory Polymers Intended for Flexible Electronics

Thiol-ene/acrylate-based shape memory polymers (SMPs) with tunable mechanical and thermomechanical properties are promising substrate materials for flexible electronics applications. These UV-curable polymer compositions can easily be polymerized onto pre-fabricated electronic components and can be...

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Autores principales: Frewin, Christopher L., Ecker, Melanie, Joshi-Imre, Alexandra, Kamgue, Jonathan, Waddell, Jeanneane, Danda, Vindhya Reddy, Stiller, Allison M., Voit, Walter E., Pancrazio, Joseph J.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6571767/
https://www.ncbi.nlm.nih.gov/pubmed/31108911
http://dx.doi.org/10.3390/polym11050902
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author Frewin, Christopher L.
Ecker, Melanie
Joshi-Imre, Alexandra
Kamgue, Jonathan
Waddell, Jeanneane
Danda, Vindhya Reddy
Stiller, Allison M.
Voit, Walter E.
Pancrazio, Joseph J.
author_facet Frewin, Christopher L.
Ecker, Melanie
Joshi-Imre, Alexandra
Kamgue, Jonathan
Waddell, Jeanneane
Danda, Vindhya Reddy
Stiller, Allison M.
Voit, Walter E.
Pancrazio, Joseph J.
author_sort Frewin, Christopher L.
collection PubMed
description Thiol-ene/acrylate-based shape memory polymers (SMPs) with tunable mechanical and thermomechanical properties are promising substrate materials for flexible electronics applications. These UV-curable polymer compositions can easily be polymerized onto pre-fabricated electronic components and can be molded into desired geometries to provide a shape-changing behavior or a tunable softness. Alternatively, SMPs may be prepared as a flat substrate, and electronic circuitry may be built directly on top by thin film processing technologies. Whichever way the final structure is produced, the operation of electronic circuits will be influenced by the electrical and mechanical properties of the underlying (and sometimes also encapsulating) SMP substrate. Here, we present electronic properties, such as permittivity and resistivity of a typical SMP composition that has a low glass transition temperature (between 40 and 60 °C dependent on the curing process) in different thermomechanical states of polymer. We fabricated parallel plate capacitors from a previously reported SMP composition (fully softening (FS)-SMP) using two different curing processes, and then we determined the electrical properties of relative permittivity and resistivity below and above the glass transition temperature. Our data shows that the curing process influenced the electrical permittivity, but not the electrical resistivity. Corona-Kelvin metrology evaluated the quality of the surface of FS-SMP spun on the wafer. Overall, FS-SMP demonstrates resistivity appropriate for use as an insulating material.
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spelling pubmed-65717672019-06-18 Electrical Properties of Thiol-ene-based Shape Memory Polymers Intended for Flexible Electronics Frewin, Christopher L. Ecker, Melanie Joshi-Imre, Alexandra Kamgue, Jonathan Waddell, Jeanneane Danda, Vindhya Reddy Stiller, Allison M. Voit, Walter E. Pancrazio, Joseph J. Polymers (Basel) Article Thiol-ene/acrylate-based shape memory polymers (SMPs) with tunable mechanical and thermomechanical properties are promising substrate materials for flexible electronics applications. These UV-curable polymer compositions can easily be polymerized onto pre-fabricated electronic components and can be molded into desired geometries to provide a shape-changing behavior or a tunable softness. Alternatively, SMPs may be prepared as a flat substrate, and electronic circuitry may be built directly on top by thin film processing technologies. Whichever way the final structure is produced, the operation of electronic circuits will be influenced by the electrical and mechanical properties of the underlying (and sometimes also encapsulating) SMP substrate. Here, we present electronic properties, such as permittivity and resistivity of a typical SMP composition that has a low glass transition temperature (between 40 and 60 °C dependent on the curing process) in different thermomechanical states of polymer. We fabricated parallel plate capacitors from a previously reported SMP composition (fully softening (FS)-SMP) using two different curing processes, and then we determined the electrical properties of relative permittivity and resistivity below and above the glass transition temperature. Our data shows that the curing process influenced the electrical permittivity, but not the electrical resistivity. Corona-Kelvin metrology evaluated the quality of the surface of FS-SMP spun on the wafer. Overall, FS-SMP demonstrates resistivity appropriate for use as an insulating material. MDPI 2019-05-17 /pmc/articles/PMC6571767/ /pubmed/31108911 http://dx.doi.org/10.3390/polym11050902 Text en © 2019 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Frewin, Christopher L.
Ecker, Melanie
Joshi-Imre, Alexandra
Kamgue, Jonathan
Waddell, Jeanneane
Danda, Vindhya Reddy
Stiller, Allison M.
Voit, Walter E.
Pancrazio, Joseph J.
Electrical Properties of Thiol-ene-based Shape Memory Polymers Intended for Flexible Electronics
title Electrical Properties of Thiol-ene-based Shape Memory Polymers Intended for Flexible Electronics
title_full Electrical Properties of Thiol-ene-based Shape Memory Polymers Intended for Flexible Electronics
title_fullStr Electrical Properties of Thiol-ene-based Shape Memory Polymers Intended for Flexible Electronics
title_full_unstemmed Electrical Properties of Thiol-ene-based Shape Memory Polymers Intended for Flexible Electronics
title_short Electrical Properties of Thiol-ene-based Shape Memory Polymers Intended for Flexible Electronics
title_sort electrical properties of thiol-ene-based shape memory polymers intended for flexible electronics
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6571767/
https://www.ncbi.nlm.nih.gov/pubmed/31108911
http://dx.doi.org/10.3390/polym11050902
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