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Transport Properties of One-Step Compression Molded Epoxy Nanocomposite Foams

Owing to their high strength and stiffness, thermal and environmental stability, lower shrinkage, and water resistance, epoxy resins have been the preferred matrix for the development of syntactic foams using hollow glass microspheres. Although these foams are exploited in multiple applications, one...

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Autores principales: Martin-Gallego, Mario, Lopez-Hernandez, Emil, Pinto, Javier, Rodriguez-Perez, Miguel A., Lopez-Manchado, Miguel A., Verdejo, Raquel
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6572515/
https://www.ncbi.nlm.nih.gov/pubmed/31052215
http://dx.doi.org/10.3390/polym11050756
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author Martin-Gallego, Mario
Lopez-Hernandez, Emil
Pinto, Javier
Rodriguez-Perez, Miguel A.
Lopez-Manchado, Miguel A.
Verdejo, Raquel
author_facet Martin-Gallego, Mario
Lopez-Hernandez, Emil
Pinto, Javier
Rodriguez-Perez, Miguel A.
Lopez-Manchado, Miguel A.
Verdejo, Raquel
author_sort Martin-Gallego, Mario
collection PubMed
description Owing to their high strength and stiffness, thermal and environmental stability, lower shrinkage, and water resistance, epoxy resins have been the preferred matrix for the development of syntactic foams using hollow glass microspheres. Although these foams are exploited in multiple applications, one of their issues is the possibility of breakage of the glass hollow microspheres during processing. Here, we present a straightforward and single-step foaming protocol using expandable polymeric microspheres based on the well-established compression molding process. We demonstrate the viability of the protocol producing two sets of nanocomposite foams filled with carbon-based nanoparticles with improved transport properties.
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spelling pubmed-65725152019-06-18 Transport Properties of One-Step Compression Molded Epoxy Nanocomposite Foams Martin-Gallego, Mario Lopez-Hernandez, Emil Pinto, Javier Rodriguez-Perez, Miguel A. Lopez-Manchado, Miguel A. Verdejo, Raquel Polymers (Basel) Article Owing to their high strength and stiffness, thermal and environmental stability, lower shrinkage, and water resistance, epoxy resins have been the preferred matrix for the development of syntactic foams using hollow glass microspheres. Although these foams are exploited in multiple applications, one of their issues is the possibility of breakage of the glass hollow microspheres during processing. Here, we present a straightforward and single-step foaming protocol using expandable polymeric microspheres based on the well-established compression molding process. We demonstrate the viability of the protocol producing two sets of nanocomposite foams filled with carbon-based nanoparticles with improved transport properties. MDPI 2019-04-30 /pmc/articles/PMC6572515/ /pubmed/31052215 http://dx.doi.org/10.3390/polym11050756 Text en © 2019 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Martin-Gallego, Mario
Lopez-Hernandez, Emil
Pinto, Javier
Rodriguez-Perez, Miguel A.
Lopez-Manchado, Miguel A.
Verdejo, Raquel
Transport Properties of One-Step Compression Molded Epoxy Nanocomposite Foams
title Transport Properties of One-Step Compression Molded Epoxy Nanocomposite Foams
title_full Transport Properties of One-Step Compression Molded Epoxy Nanocomposite Foams
title_fullStr Transport Properties of One-Step Compression Molded Epoxy Nanocomposite Foams
title_full_unstemmed Transport Properties of One-Step Compression Molded Epoxy Nanocomposite Foams
title_short Transport Properties of One-Step Compression Molded Epoxy Nanocomposite Foams
title_sort transport properties of one-step compression molded epoxy nanocomposite foams
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6572515/
https://www.ncbi.nlm.nih.gov/pubmed/31052215
http://dx.doi.org/10.3390/polym11050756
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