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Thermal Characterization of Low-Dimensional Materials by Resistance Thermometers

The design, fabrication, and use of a hotspot-producing and temperature-sensing resistance thermometer for evaluating the thermal properties of low-dimensional materials are described in this paper. The materials that are characterized include one-dimensional (1D) carbon nanotubes, and two-dimension...

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Detalles Bibliográficos
Autores principales: Fu, Yifeng, Cui, Guofeng, Jeppson, Kjell
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6601052/
https://www.ncbi.nlm.nih.gov/pubmed/31146348
http://dx.doi.org/10.3390/ma12111740
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author Fu, Yifeng
Cui, Guofeng
Jeppson, Kjell
author_facet Fu, Yifeng
Cui, Guofeng
Jeppson, Kjell
author_sort Fu, Yifeng
collection PubMed
description The design, fabrication, and use of a hotspot-producing and temperature-sensing resistance thermometer for evaluating the thermal properties of low-dimensional materials are described in this paper. The materials that are characterized include one-dimensional (1D) carbon nanotubes, and two-dimensional (2D) graphene and boron nitride films. The excellent thermal performance of these materials shows great potential for cooling electronic devices and systems such as in three-dimensional (3D) integrated chip-stacks, power amplifiers, and light-emitting diodes. The thermometers are designed to be serpentine-shaped platinum resistors serving both as hotspots and temperature sensors. By using these thermometers, the thermal performance of the abovementioned emerging low-dimensional materials was evaluated with high accuracy.
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spelling pubmed-66010522019-07-18 Thermal Characterization of Low-Dimensional Materials by Resistance Thermometers Fu, Yifeng Cui, Guofeng Jeppson, Kjell Materials (Basel) Review The design, fabrication, and use of a hotspot-producing and temperature-sensing resistance thermometer for evaluating the thermal properties of low-dimensional materials are described in this paper. The materials that are characterized include one-dimensional (1D) carbon nanotubes, and two-dimensional (2D) graphene and boron nitride films. The excellent thermal performance of these materials shows great potential for cooling electronic devices and systems such as in three-dimensional (3D) integrated chip-stacks, power amplifiers, and light-emitting diodes. The thermometers are designed to be serpentine-shaped platinum resistors serving both as hotspots and temperature sensors. By using these thermometers, the thermal performance of the abovementioned emerging low-dimensional materials was evaluated with high accuracy. MDPI 2019-05-29 /pmc/articles/PMC6601052/ /pubmed/31146348 http://dx.doi.org/10.3390/ma12111740 Text en © 2019 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Review
Fu, Yifeng
Cui, Guofeng
Jeppson, Kjell
Thermal Characterization of Low-Dimensional Materials by Resistance Thermometers
title Thermal Characterization of Low-Dimensional Materials by Resistance Thermometers
title_full Thermal Characterization of Low-Dimensional Materials by Resistance Thermometers
title_fullStr Thermal Characterization of Low-Dimensional Materials by Resistance Thermometers
title_full_unstemmed Thermal Characterization of Low-Dimensional Materials by Resistance Thermometers
title_short Thermal Characterization of Low-Dimensional Materials by Resistance Thermometers
title_sort thermal characterization of low-dimensional materials by resistance thermometers
topic Review
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6601052/
https://www.ncbi.nlm.nih.gov/pubmed/31146348
http://dx.doi.org/10.3390/ma12111740
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