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Study on Delamination Between Polymer Materials and Metals in IC Packaging Process

The electronic package interconnects electronic signals from one area to another and package delamination is a serious problem in the configuration of materials. This study focused on decreasing the delamination of the low-profile fine pitch ball grid array (LFBGA) and plastic ball grid array (PBGA)...

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Detalles Bibliográficos
Autores principales:	Pan, Cheng-Tang, Wang, Shao-Yu, Yen, Chung-Kun, Ho, Chien-Kai, Yen, Jhan-Foug, Chen, Shi-Wei, Fu, Fan-Rui, Lin, Yi-Tzu, Lin, Cing-Hao, Kumar, Ajay, Shiue, Yow-Ling
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2019
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6630827/ https://www.ncbi.nlm.nih.gov/pubmed/31151173 http://dx.doi.org/10.3390/polym11060940

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