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A MEMS Micro-g Capacitive Accelerometer Based on Through-Silicon-Wafer-Etching Process

This paper presents a micromachined micro-g capacitive accelerometer with a silicon-based spring-mass sensing element. The displacement changes of the proof mass are sensed by an area-variation-based capacitive displacement transducer that is formed by the matching electrodes on both the movable pro...

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Detalles Bibliográficos
Autores principales:	Rao, Kang, Wei, Xiaoli, Zhang, Shaolin, Zhang, Mengqi, Hu, Chenyuan, Liu, Huafeng, Tu, Liang-Cheng
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2019
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6630974/ https://www.ncbi.nlm.nih.gov/pubmed/31181589 http://dx.doi.org/10.3390/mi10060380

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