Resistance Change Mechanism of Electronic Component Mounting through Contact Pressure Using Elastic Adhesive

For mounting electronic components through contact pressure using elastic adhesives, a high contact resistance is an inevitable issue in achieving solderless wiring in a low-temperature and low-cost process. To decrease the contact resistance, we investigated the resistance change mechanism by measu...

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Detalles Bibliográficos
Autores principales: Sato, Takashi, Koshi, Tomoya, Iwase, Eiji
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6631103/
https://www.ncbi.nlm.nih.gov/pubmed/31207964
http://dx.doi.org/10.3390/mi10060396

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6631103/
https://www.ncbi.nlm.nih.gov/pubmed/31207964
http://dx.doi.org/10.3390/mi10060396

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