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Resistance Change Mechanism of Electronic Component Mounting through Contact Pressure Using Elastic Adhesive
For mounting electronic components through contact pressure using elastic adhesives, a high contact resistance is an inevitable issue in achieving solderless wiring in a low-temperature and low-cost process. To decrease the contact resistance, we investigated the resistance change mechanism by measu...
| Autores principales: | , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2019
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6631103/ https://www.ncbi.nlm.nih.gov/pubmed/31207964 http://dx.doi.org/10.3390/mi10060396 |