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Robust Surface Plasmon Resonance Chips for Repetitive and Accurate Analysis of Lignin–Peptide Interactions
[Image: see text] We have developed novel surface plasmon resonance (SPR) sensor chips whose surfaces bear newly synthesized functional self-assembled monolayer (SAM) anchoring lignin through covalent chemical bonds. The SPR sensor chips are remarkably robust and suitable for repetitive and accurate...
Autores principales: | , , , , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
American Chemical Society
2018
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Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6644341/ https://www.ncbi.nlm.nih.gov/pubmed/31458905 http://dx.doi.org/10.1021/acsomega.8b01161 |
Sumario: | [Image: see text] We have developed novel surface plasmon resonance (SPR) sensor chips whose surfaces bear newly synthesized functional self-assembled monolayer (SAM) anchoring lignin through covalent chemical bonds. The SPR sensor chips are remarkably robust and suitable for repetitive and accurate measurement of noncovalent lignin–peptide interactions, which is of significant interest in the chemical or biochemical conversion of renewable woody biomass to valuable chemical feedstocks. The lignin-anchored SAMs were prepared for the first time by click chemistry based on an azide–alkyne Huisgen cycloaddition: mixed SAMs are fabricated on gold thin film using a mixture of alkynyl and methyl thioalkyloligo(ethylene oxide) disulfides and then reacted with azidated milled wood lignins to furnish the functional SAMs anchoring lignins covalently. The resulting SAMs were characterized using infrared reflection–absorption, Raman, and X-ray photoelectron spectroscopies to confirm covalent immobilization of the lignins to the SAMs via triazole linkages and also to reveal that the SAM formation induces a helical conformation of the ethylene oxide chains. Further, SPR measurements of the noncovalent lignin–peptide interactions using lignin-binding peptides have demonstrated high reproducibility and durability of the prepared lignin-anchored sensor chips. |
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