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Environmentally-Friendly High-Density Polyethylene-Bonded Plywood Panels
Thermoplastic films exhibit good potential to be used as adhesives for the production of veneer-based composites. This work presents the first effort to develop and evaluate composites based on alder veneers and high-density polyethylene (HDPE) film. The effects of hot-pressing temperature (140, 160...
Autores principales: | , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2019
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6680989/ https://www.ncbi.nlm.nih.gov/pubmed/31288498 http://dx.doi.org/10.3390/polym11071166 |
Sumario: | Thermoplastic films exhibit good potential to be used as adhesives for the production of veneer-based composites. This work presents the first effort to develop and evaluate composites based on alder veneers and high-density polyethylene (HDPE) film. The effects of hot-pressing temperature (140, 160, and 180 °C), hot-pressing pressure (0.8, 1.2, and 1.6 MPa), hot-pressing time (1, 2, 3, and 5 min), and type of adhesives on the physical and mechanical properties of alder plywood panels were investigated. The effects of these variables on the core-layer temperature during the hot pressing of multiplywood panels using various adhesives were also studied. Three types of adhesives were used: urea–formaldehyde (UF), phenol–formaldehyde (PF), and HDPE film. UF and PF adhesives were used for the comparison. The findings of this work indicate that formaldehyde-free HDPE film adhesive gave values of mechanical properties of alder plywood panels that are comparable to those obtained with traditional UF and PF adhesives, even though the adhesive dosage and pressing pressure were lower than when UF and PF adhesives were used. The obtained bonding strength values of HDPE-bonded alder plywood panels ranged from 0.74 to 2.38 MPa and met the European Standard EN 314-2 for Class 1 plywood. The optimum conditions for the bonding of HDPE plywood were 160 °C, 0.8 MPa, and 3 min. |
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