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Water‐Based Solution Processing and Wafer‐Scale Integration of All‐Graphene Humidity Sensors
One of the main advantages of 2D materials for various applications is that they can be prepared in form of water‐based solutions. The high yield and cost‐effectiveness of this method make them of great interest for printed electronics, composites, and bio‐ and healthcare technologies. However, once...
Autores principales: | , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
John Wiley and Sons Inc.
2019
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6685499/ https://www.ncbi.nlm.nih.gov/pubmed/31406661 http://dx.doi.org/10.1002/advs.201802318 |
Sumario: | One of the main advantages of 2D materials for various applications is that they can be prepared in form of water‐based solutions. The high yield and cost‐effectiveness of this method make them of great interest for printed electronics, composites, and bio‐ and healthcare technologies. However, once deposited on a substrate, etching away these solution‐processed materials is a difficult task, yet crucial for pattern definition and thus device fabrication. In particular, the realization of micrometer‐sized patterns requires mesh and paste optimization when screen‐printed or solvent‐engineered and surface functionalization when inkjet‐printed, both usually involving additional postdeposition steps. These constraints are holding back the integration of these 2D materials in devices and applications. In this work, a method for the fabrication of micrometer‐sized well‐defined patterns in water‐based 2D materials is presented, with an extensive characterization of the films and patterns obtained. The method is ultimately used to create humidity sensors with performance comparable to that of commercial ones. These sensor devices are fabricated onto a 4′ silicon and polyethylene terephthalate (PET) wafers to create all‐graphene humidity sensors that are flexible, transparent, and compatible with current complementary metal–oxide–semiconductor (CMOS) and roll‐to‐roll workflows. |
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