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Ultrahigh thermal isolation across heterogeneously layered two-dimensional materials

Heterogeneous integration of nanomaterials has enabled advanced electronics and photonics applications. However, similar progress has been challenging for thermal applications, in part due to shorter wavelengths of heat carriers (phonons) compared to electrons and photons. Here, we demonstrate unusu...

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Autores principales: Vaziri, Sam, Yalon, Eilam, Muñoz Rojo, Miguel, Suryavanshi, Saurabh V., Zhang, Huairuo, McClellan, Connor J., Bailey, Connor S., Smithe, Kirby K. H., Gabourie, Alexander J., Chen, Victoria, Deshmukh, Sanchit, Bendersky, Leonid, Davydov, Albert V., Pop, Eric
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Association for the Advancement of Science 2019
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6697438/
https://www.ncbi.nlm.nih.gov/pubmed/31453337
http://dx.doi.org/10.1126/sciadv.aax1325
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author Vaziri, Sam
Yalon, Eilam
Muñoz Rojo, Miguel
Suryavanshi, Saurabh V.
Zhang, Huairuo
McClellan, Connor J.
Bailey, Connor S.
Smithe, Kirby K. H.
Gabourie, Alexander J.
Chen, Victoria
Deshmukh, Sanchit
Bendersky, Leonid
Davydov, Albert V.
Pop, Eric
author_facet Vaziri, Sam
Yalon, Eilam
Muñoz Rojo, Miguel
Suryavanshi, Saurabh V.
Zhang, Huairuo
McClellan, Connor J.
Bailey, Connor S.
Smithe, Kirby K. H.
Gabourie, Alexander J.
Chen, Victoria
Deshmukh, Sanchit
Bendersky, Leonid
Davydov, Albert V.
Pop, Eric
author_sort Vaziri, Sam
collection PubMed
description Heterogeneous integration of nanomaterials has enabled advanced electronics and photonics applications. However, similar progress has been challenging for thermal applications, in part due to shorter wavelengths of heat carriers (phonons) compared to electrons and photons. Here, we demonstrate unusually high thermal isolation across ultrathin heterostructures, achieved by layering atomically thin two-dimensional (2D) materials. We realize artificial stacks of monolayer graphene, MoS(2), and WSe(2) with thermal resistance greater than 100 times thicker SiO(2) and effective thermal conductivity lower than air at room temperature. Using Raman thermometry, we simultaneously identify the thermal resistance between any 2D monolayers in the stack. Ultrahigh thermal isolation is achieved through the mismatch in mass density and phonon density of states between the 2D layers. These thermal metamaterials are an example in the emerging field of phononics and could find applications where ultrathin thermal insulation is desired, in thermal energy harvesting, or for routing heat in ultracompact geometries.
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spelling pubmed-66974382019-08-26 Ultrahigh thermal isolation across heterogeneously layered two-dimensional materials Vaziri, Sam Yalon, Eilam Muñoz Rojo, Miguel Suryavanshi, Saurabh V. Zhang, Huairuo McClellan, Connor J. Bailey, Connor S. Smithe, Kirby K. H. Gabourie, Alexander J. Chen, Victoria Deshmukh, Sanchit Bendersky, Leonid Davydov, Albert V. Pop, Eric Sci Adv Research Articles Heterogeneous integration of nanomaterials has enabled advanced electronics and photonics applications. However, similar progress has been challenging for thermal applications, in part due to shorter wavelengths of heat carriers (phonons) compared to electrons and photons. Here, we demonstrate unusually high thermal isolation across ultrathin heterostructures, achieved by layering atomically thin two-dimensional (2D) materials. We realize artificial stacks of monolayer graphene, MoS(2), and WSe(2) with thermal resistance greater than 100 times thicker SiO(2) and effective thermal conductivity lower than air at room temperature. Using Raman thermometry, we simultaneously identify the thermal resistance between any 2D monolayers in the stack. Ultrahigh thermal isolation is achieved through the mismatch in mass density and phonon density of states between the 2D layers. These thermal metamaterials are an example in the emerging field of phononics and could find applications where ultrathin thermal insulation is desired, in thermal energy harvesting, or for routing heat in ultracompact geometries. American Association for the Advancement of Science 2019-08-16 /pmc/articles/PMC6697438/ /pubmed/31453337 http://dx.doi.org/10.1126/sciadv.aax1325 Text en Copyright © 2019 The Authors, some rights reserved; exclusive licensee American Association for the Advancement of Science. No claim to original U.S. Government Works. Distributed under a Creative Commons Attribution NonCommercial License 4.0 (CC BY-NC). http://creativecommons.org/licenses/by-nc/4.0/ This is an open-access article distributed under the terms of the Creative Commons Attribution-NonCommercial license (http://creativecommons.org/licenses/by-nc/4.0/) , which permits use, distribution, and reproduction in any medium, so long as the resultant use is not for commercial advantage and provided the original work is properly cited.
spellingShingle Research Articles
Vaziri, Sam
Yalon, Eilam
Muñoz Rojo, Miguel
Suryavanshi, Saurabh V.
Zhang, Huairuo
McClellan, Connor J.
Bailey, Connor S.
Smithe, Kirby K. H.
Gabourie, Alexander J.
Chen, Victoria
Deshmukh, Sanchit
Bendersky, Leonid
Davydov, Albert V.
Pop, Eric
Ultrahigh thermal isolation across heterogeneously layered two-dimensional materials
title Ultrahigh thermal isolation across heterogeneously layered two-dimensional materials
title_full Ultrahigh thermal isolation across heterogeneously layered two-dimensional materials
title_fullStr Ultrahigh thermal isolation across heterogeneously layered two-dimensional materials
title_full_unstemmed Ultrahigh thermal isolation across heterogeneously layered two-dimensional materials
title_short Ultrahigh thermal isolation across heterogeneously layered two-dimensional materials
title_sort ultrahigh thermal isolation across heterogeneously layered two-dimensional materials
topic Research Articles
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6697438/
https://www.ncbi.nlm.nih.gov/pubmed/31453337
http://dx.doi.org/10.1126/sciadv.aax1325
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