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Structure and properties of Sn-Cu lead-free solders in electronics packaging
With the development of lead-free solders in electronic packaging, Sn-Cu lead-free solder has attracted wide attention due to its excellent comprehensive performance and low cost. In this article, we present recent developments in Sn-Cu lead-free solder alloys. From the microstructure and interfacia...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Taylor & Francis
2019
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6711112/ https://www.ncbi.nlm.nih.gov/pubmed/31489052 http://dx.doi.org/10.1080/14686996.2019.1591168 |