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Substrate Temperature Dependent Microstructure and Electron-Induced Secondary Electron Emission Properties of Magnetron Sputter-Deposited Amorphous Carbon Films

For special instruments or equipments including particle accelerators, space microwave devices and spacecrafts, the suppression for electron-induced secondary electron emission (SEE) occurring on the component surfaces is of great significance due to a negative influence caused by SEE on their norma...

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Detalles Bibliográficos
Autores principales: Li, Jie, Yi, Xingkang, Hu, Wenbo, Gao, Buyu, Li, Yongdong, Wu, Shengli, Lin, Shu, Zhang, Jintao
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6720795/
https://www.ncbi.nlm.nih.gov/pubmed/31430848
http://dx.doi.org/10.3390/ma12162631
Descripción
Sumario:For special instruments or equipments including particle accelerators, space microwave devices and spacecrafts, the suppression for electron-induced secondary electron emission (SEE) occurring on the component surfaces is of great significance due to a negative influence caused by SEE on their normal operations. In this paper, amorphous carbon (a-C) films were prepared on stainless-steel substrates by radio frequency magnetron sputtering, and the effects of substrate temperature (T(s)) and continuous electron bombardment on the microstructure and secondary electron emission yield (SEY) of a-C film were investigated in order to achieve a better inhibition for SEE. The experimental results show that a rise of T(s) during the a-C film preparation is conducive to a SEY reduction and an increase of multipactor threshold due to the increases of surface roughness and sp(2) bond content. In addition, although the SEY of a-C film has a slight increase with the rise of electron bombardment time, the a-C film sample with a lower SEY keeps its lower SEY all the time during continuous electron bombardment. The a-C film prepared at T(s) of 500 °C has the lowest SEY peak value of 1.09 with a reduction of 30.6% in comparison with the stainless-steel substrate.