Dielectric and Thermal Conductivity of Epoxy Resin Impregnated Nano-h-BN Modified Insulating Paper

Epoxy resin-impregnated insulation paper (RIP) composites are used as the inner insulation of dry condenser bushing in the ultra-high voltage direct current (UHVDC) power transmission system. To improve the dielectric properties and heat conductivity of RIP, hexagonal boron nitride (h-BN) nano-flakes are added to the insulation paper at concentrations of 0–50 wt % before impregnation with pure epoxy resin. X-ray diffraction (XRD), scanning electron microscopy (SEM) observations, thermal conductivity as well as the typical dielectric properties of direct current (DC) volume conductivity. DC breakdown strength and space charge characteristics were obtained. The maximum of nano-h-BN modified heat conductivity reach 0.478 W/(m·K), increased by 139% compared with unmodified RIP. The DC breakdown electric field strength of the nano-h-BN modified RIP does not reduce much. The conductivity of nano-h-BN modified is less sensitive to temperature. As well, the space charge is suppressed when the content is 50 wt %. Therefore, the nano-h-BN modified RIP is potentially useful in practical dry DC bushing application.