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Emerging Encapsulation Technologies for Long-Term Reliability of Microfabricated Implantable Devices

The development of reliable long-term encapsulation technologies for implantable biomedical devices is of paramount importance for the safe and stable operation of implants in the body over a period of several decades. Conventional technologies based on titanium or ceramic packaging, however, are no...

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Autores principales: Ahn, Seung-Hee, Jeong, Joonsoo, Kim, Sung June
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6723304/
https://www.ncbi.nlm.nih.gov/pubmed/31370259
http://dx.doi.org/10.3390/mi10080508
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author Ahn, Seung-Hee
Jeong, Joonsoo
Kim, Sung June
author_facet Ahn, Seung-Hee
Jeong, Joonsoo
Kim, Sung June
author_sort Ahn, Seung-Hee
collection PubMed
description The development of reliable long-term encapsulation technologies for implantable biomedical devices is of paramount importance for the safe and stable operation of implants in the body over a period of several decades. Conventional technologies based on titanium or ceramic packaging, however, are not suitable for encapsulating microfabricated devices due to their limited scalability, incompatibility with microfabrication processes, and difficulties with miniaturization. A variety of emerging materials have been proposed for encapsulation of microfabricated implants, including thin-film inorganic coatings of Al(2)O(3), HfO(2), SiO(2), SiC, and diamond, as well as organic polymers of polyimide, parylene, liquid crystal polymer, silicone elastomer, SU-8, and cyclic olefin copolymer. While none of these materials have yet been proven to be as hermetic as conventional metal packages nor widely used in regulatory approved devices for chronic implantation, a number of studies have demonstrated promising outcomes on their long-term encapsulation performance through a multitude of fabrication and testing methodologies. The present review article aims to provide a comprehensive, up-to-date overview of the long-term encapsulation performance of these emerging materials with a specific focus on publications that have quantitatively estimated the lifetime of encapsulation technologies in aqueous environments.
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spelling pubmed-67233042019-09-10 Emerging Encapsulation Technologies for Long-Term Reliability of Microfabricated Implantable Devices Ahn, Seung-Hee Jeong, Joonsoo Kim, Sung June Micromachines (Basel) Review The development of reliable long-term encapsulation technologies for implantable biomedical devices is of paramount importance for the safe and stable operation of implants in the body over a period of several decades. Conventional technologies based on titanium or ceramic packaging, however, are not suitable for encapsulating microfabricated devices due to their limited scalability, incompatibility with microfabrication processes, and difficulties with miniaturization. A variety of emerging materials have been proposed for encapsulation of microfabricated implants, including thin-film inorganic coatings of Al(2)O(3), HfO(2), SiO(2), SiC, and diamond, as well as organic polymers of polyimide, parylene, liquid crystal polymer, silicone elastomer, SU-8, and cyclic olefin copolymer. While none of these materials have yet been proven to be as hermetic as conventional metal packages nor widely used in regulatory approved devices for chronic implantation, a number of studies have demonstrated promising outcomes on their long-term encapsulation performance through a multitude of fabrication and testing methodologies. The present review article aims to provide a comprehensive, up-to-date overview of the long-term encapsulation performance of these emerging materials with a specific focus on publications that have quantitatively estimated the lifetime of encapsulation technologies in aqueous environments. MDPI 2019-07-31 /pmc/articles/PMC6723304/ /pubmed/31370259 http://dx.doi.org/10.3390/mi10080508 Text en © 2019 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Review
Ahn, Seung-Hee
Jeong, Joonsoo
Kim, Sung June
Emerging Encapsulation Technologies for Long-Term Reliability of Microfabricated Implantable Devices
title Emerging Encapsulation Technologies for Long-Term Reliability of Microfabricated Implantable Devices
title_full Emerging Encapsulation Technologies for Long-Term Reliability of Microfabricated Implantable Devices
title_fullStr Emerging Encapsulation Technologies for Long-Term Reliability of Microfabricated Implantable Devices
title_full_unstemmed Emerging Encapsulation Technologies for Long-Term Reliability of Microfabricated Implantable Devices
title_short Emerging Encapsulation Technologies for Long-Term Reliability of Microfabricated Implantable Devices
title_sort emerging encapsulation technologies for long-term reliability of microfabricated implantable devices
topic Review
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6723304/
https://www.ncbi.nlm.nih.gov/pubmed/31370259
http://dx.doi.org/10.3390/mi10080508
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