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Sintering Copper Nanoparticles with Photonic Additive for Printed Conductive Patterns by Intense Pulsed Light

In this study, an ink formulation was developed to prepare conductive copper thin films with compact structure by using intense pulsed light (IPL) sintering. To improve inter-particle connections in the sintering process, a cuprous oxide shell was synthesized over copper nanoparticles (CuNP). This c...

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Detalles Bibliográficos
Autores principales:	Chung, Wan-Yu, Lai, Yi-Chin, Yonezawa, Tetsu, Liao, Ying-Chih
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2019
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6723544/ https://www.ncbi.nlm.nih.gov/pubmed/31349711 http://dx.doi.org/10.3390/nano9081071

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