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Optimization of Boron Nitride Sphere Loading in Epoxy: Enhanced Thermal Conductivity and Excellent Electrical Insulation

Thermally conductive but electrically insulating materials are highly desirable for thermal management applications in electrical encapsulation and future energy fields, for instance, superconducting magnet insulation in nuclear fusion systems. However, the traditional approaches usually suffer from...

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Autores principales: Zhang, Hua, Huang, Rongjin, Li, Yong, Li, Hongbo, Wu, Zhixiong, Huang, Jianjun, Yu, Bin, Gao, Xiang, Li, Jiangang, Li, Laifeng
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6723785/
https://www.ncbi.nlm.nih.gov/pubmed/31409004
http://dx.doi.org/10.3390/polym11081335
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author Zhang, Hua
Huang, Rongjin
Li, Yong
Li, Hongbo
Wu, Zhixiong
Huang, Jianjun
Yu, Bin
Gao, Xiang
Li, Jiangang
Li, Laifeng
author_facet Zhang, Hua
Huang, Rongjin
Li, Yong
Li, Hongbo
Wu, Zhixiong
Huang, Jianjun
Yu, Bin
Gao, Xiang
Li, Jiangang
Li, Laifeng
author_sort Zhang, Hua
collection PubMed
description Thermally conductive but electrically insulating materials are highly desirable for thermal management applications in electrical encapsulation and future energy fields, for instance, superconducting magnet insulation in nuclear fusion systems. However, the traditional approaches usually suffer from inefficient and anisotropic enhancement of thermal conductivity or deterioration of electrical insulating property. In this study, using boron nitride sphere (BNS) agglomerated by boron nitride (BN) sheets as fillers, we fabricate a series of epoxy/BNS composites by a new approach, namely gravity-mix, and realize the controllable BNS loading fractions in the wide range of 5–40 wt%. The composites exhibited thermal conductivity of about 765% and enhancement at BNS loading of 40 wt%. The thermal conductivity up to 0.84 W·m(−1)·K(−1) at 77 K and 1.66 W·m(−1)·K(−1) at 298 K was observed in preservation of a higher dielectric constant and a lower dielectric loss, as expected, because boron nitride is a naturally dielectric material. It is worth noting that the thermal property was almost isotropous on account of the spherical structure of BNS in epoxy. Meanwhile, the reduction of the coefficient of thermal expansion (CTE) was largely reduced, by up to 42.5% at a temperature range of 77–298 K.
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spelling pubmed-67237852019-09-10 Optimization of Boron Nitride Sphere Loading in Epoxy: Enhanced Thermal Conductivity and Excellent Electrical Insulation Zhang, Hua Huang, Rongjin Li, Yong Li, Hongbo Wu, Zhixiong Huang, Jianjun Yu, Bin Gao, Xiang Li, Jiangang Li, Laifeng Polymers (Basel) Article Thermally conductive but electrically insulating materials are highly desirable for thermal management applications in electrical encapsulation and future energy fields, for instance, superconducting magnet insulation in nuclear fusion systems. However, the traditional approaches usually suffer from inefficient and anisotropic enhancement of thermal conductivity or deterioration of electrical insulating property. In this study, using boron nitride sphere (BNS) agglomerated by boron nitride (BN) sheets as fillers, we fabricate a series of epoxy/BNS composites by a new approach, namely gravity-mix, and realize the controllable BNS loading fractions in the wide range of 5–40 wt%. The composites exhibited thermal conductivity of about 765% and enhancement at BNS loading of 40 wt%. The thermal conductivity up to 0.84 W·m(−1)·K(−1) at 77 K and 1.66 W·m(−1)·K(−1) at 298 K was observed in preservation of a higher dielectric constant and a lower dielectric loss, as expected, because boron nitride is a naturally dielectric material. It is worth noting that the thermal property was almost isotropous on account of the spherical structure of BNS in epoxy. Meanwhile, the reduction of the coefficient of thermal expansion (CTE) was largely reduced, by up to 42.5% at a temperature range of 77–298 K. MDPI 2019-08-12 /pmc/articles/PMC6723785/ /pubmed/31409004 http://dx.doi.org/10.3390/polym11081335 Text en © 2019 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Zhang, Hua
Huang, Rongjin
Li, Yong
Li, Hongbo
Wu, Zhixiong
Huang, Jianjun
Yu, Bin
Gao, Xiang
Li, Jiangang
Li, Laifeng
Optimization of Boron Nitride Sphere Loading in Epoxy: Enhanced Thermal Conductivity and Excellent Electrical Insulation
title Optimization of Boron Nitride Sphere Loading in Epoxy: Enhanced Thermal Conductivity and Excellent Electrical Insulation
title_full Optimization of Boron Nitride Sphere Loading in Epoxy: Enhanced Thermal Conductivity and Excellent Electrical Insulation
title_fullStr Optimization of Boron Nitride Sphere Loading in Epoxy: Enhanced Thermal Conductivity and Excellent Electrical Insulation
title_full_unstemmed Optimization of Boron Nitride Sphere Loading in Epoxy: Enhanced Thermal Conductivity and Excellent Electrical Insulation
title_short Optimization of Boron Nitride Sphere Loading in Epoxy: Enhanced Thermal Conductivity and Excellent Electrical Insulation
title_sort optimization of boron nitride sphere loading in epoxy: enhanced thermal conductivity and excellent electrical insulation
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6723785/
https://www.ncbi.nlm.nih.gov/pubmed/31409004
http://dx.doi.org/10.3390/polym11081335
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