Reliability issues of lead-free solder joints in electronic devices

Electronic products are evolving towards miniaturization, high integration, and multi-function, which undoubtedly puts forward higher requirements for the reliability of solder joints in electronic packaging. Approximately 70% of failure in electronic devices originates during the packaging process,...

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Detalles Bibliográficos
Autores principales: Jiang, Nan, Zhang, Liang, Liu, Zhi-Quan, Sun, Lei, Long, Wei-Min, He, Peng, Xiong, Ming-Yue, Zhao, Meng
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Taylor & Francis 2019
Materias:
Optical, Magnetic and Electronic Device Materials
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6735330/
https://www.ncbi.nlm.nih.gov/pubmed/31528239
http://dx.doi.org/10.1080/14686996.2019.1640072

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6735330/
https://www.ncbi.nlm.nih.gov/pubmed/31528239
http://dx.doi.org/10.1080/14686996.2019.1640072

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