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Die-Attach Structure of Silicon-on-Glass MEMS Devices Considering Asymmetric Packaging Stress and Thermal Stress

Die attach is a typical process that induces thermal stress in the fabrication of microelectromechanical system (MEMS) devices. One solution to this problem is attaching a portion of the die to the package. In such partial die bonding, the lack of control over the spreading of the adhesive can cause...

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Detalles Bibliográficos
Autores principales: An, Jun Eon, Park, Usung, Jung, Dong Geon, Park, Chihyun, Kong, Seong Ho
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6767341/
https://www.ncbi.nlm.nih.gov/pubmed/31540113
http://dx.doi.org/10.3390/s19183979

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