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Field‐Effect Transistors Based on 2D Organic Semiconductors Developed by a Hybrid Deposition Method

Solution‐processed 2D organic semiconductors (OSCs) have drawn considerable attention because of their novel applications from flexible optoelectronics to biosensors. However, obtaining well‐oriented sheets of 2D organic materials with low defect density still poses a challenge. Here, a highly cryst...

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Detalles Bibliográficos
Autores principales: Zhou, Zhiwen, Wu, Qisheng, Wang, Sijia, Huang, Yu‐Ting, Guo, Hua, Feng, Shien‐Ping, Chan, Paddy Kwok Leung
Formato: Online Artículo Texto
Lenguaje:English
Publicado: John Wiley and Sons Inc. 2019
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6774035/
https://www.ncbi.nlm.nih.gov/pubmed/31592413
http://dx.doi.org/10.1002/advs.201900775
Descripción
Sumario:Solution‐processed 2D organic semiconductors (OSCs) have drawn considerable attention because of their novel applications from flexible optoelectronics to biosensors. However, obtaining well‐oriented sheets of 2D organic materials with low defect density still poses a challenge. Here, a highly crystallized 2,9‐didecyldinaphtho[2,3‐b:2′,3′‐f]thieno[3,2‐b]thiophene (C(10)‐DNTT) monolayer crystal with large‐area uniformity is obtained by an ultraslow shearing (USS) method and its growth pattern shows a kinetic Wulff's construction supported by theoretical calculations of surface energies. The resulting seamless and highly crystalline monolayers are then used as templates for thermally depositing another C(10)‐DNTT ultrathin top‐up film. The organic thin films deposited by this hybrid approach show an interesting coherence structure with a copied molecular orientation of the templating crystal. The organic field‐effect transistors developed by these hybrid C(10)‐DNTT films exhibit improved carrier mobility of 14.7 cm(2) V(−1) s(−1) as compared with 7.3 cm(2) V(−1) s(−1) achieved by pure thermal evaporation (100% improvement) and 2.8 cm(2) V(−1) s(−1) achieved by solution sheared monolayer C(10)‐DNTT. This work establishes a simple yet effective approach for fabricating high‐performance and low‐cost electronics on a large scale.