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Investigation on the Edge Chipping in Ultrasonic Assisted Sawing of Monocrystalline Silicon
Monocrystalline silicon is an important semiconductor material and occupies a large part of the market demand. However, as a hard-brittle material, monocrystalline silicon is extremely prone to happen edge chipping during sawing processing. The edge chipping seriously affects the quality and perform...
Autores principales: | , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2019
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6780082/ https://www.ncbi.nlm.nih.gov/pubmed/31527434 http://dx.doi.org/10.3390/mi10090616 |
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author | Shen, Jianyun Zhu, Xu Chen, Jianbin Tao, Ping Wu, Xian |
author_facet | Shen, Jianyun Zhu, Xu Chen, Jianbin Tao, Ping Wu, Xian |
author_sort | Shen, Jianyun |
collection | PubMed |
description | Monocrystalline silicon is an important semiconductor material and occupies a large part of the market demand. However, as a hard-brittle material, monocrystalline silicon is extremely prone to happen edge chipping during sawing processing. The edge chipping seriously affects the quality and performance of silicon wafers. In this paper, both conventional and ultrasonicassisted sawing tests were carried out on monocrystalline silicon to study the formation mechanism of edge chipping. The shape and size of edge chipping after sawing process were observed and measured. The experimental results demonstrated that different sawing processes present different material removal modes and edge quality. The mode of crack propagation was continuous cracks in conventional sawing process, while the expansion mode in ultrasonic assisted sawing was blasting microcracks. This results in the cutting force of ultrasonic assisted sawing becomes much smaller than that of conventional sawing process, which can reduce the size of edge chipping and improve the quality of machined surface. |
format | Online Article Text |
id | pubmed-6780082 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2019 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-67800822019-10-30 Investigation on the Edge Chipping in Ultrasonic Assisted Sawing of Monocrystalline Silicon Shen, Jianyun Zhu, Xu Chen, Jianbin Tao, Ping Wu, Xian Micromachines (Basel) Article Monocrystalline silicon is an important semiconductor material and occupies a large part of the market demand. However, as a hard-brittle material, monocrystalline silicon is extremely prone to happen edge chipping during sawing processing. The edge chipping seriously affects the quality and performance of silicon wafers. In this paper, both conventional and ultrasonicassisted sawing tests were carried out on monocrystalline silicon to study the formation mechanism of edge chipping. The shape and size of edge chipping after sawing process were observed and measured. The experimental results demonstrated that different sawing processes present different material removal modes and edge quality. The mode of crack propagation was continuous cracks in conventional sawing process, while the expansion mode in ultrasonic assisted sawing was blasting microcracks. This results in the cutting force of ultrasonic assisted sawing becomes much smaller than that of conventional sawing process, which can reduce the size of edge chipping and improve the quality of machined surface. MDPI 2019-09-16 /pmc/articles/PMC6780082/ /pubmed/31527434 http://dx.doi.org/10.3390/mi10090616 Text en © 2019 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Shen, Jianyun Zhu, Xu Chen, Jianbin Tao, Ping Wu, Xian Investigation on the Edge Chipping in Ultrasonic Assisted Sawing of Monocrystalline Silicon |
title | Investigation on the Edge Chipping in Ultrasonic Assisted Sawing of Monocrystalline Silicon |
title_full | Investigation on the Edge Chipping in Ultrasonic Assisted Sawing of Monocrystalline Silicon |
title_fullStr | Investigation on the Edge Chipping in Ultrasonic Assisted Sawing of Monocrystalline Silicon |
title_full_unstemmed | Investigation on the Edge Chipping in Ultrasonic Assisted Sawing of Monocrystalline Silicon |
title_short | Investigation on the Edge Chipping in Ultrasonic Assisted Sawing of Monocrystalline Silicon |
title_sort | investigation on the edge chipping in ultrasonic assisted sawing of monocrystalline silicon |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6780082/ https://www.ncbi.nlm.nih.gov/pubmed/31527434 http://dx.doi.org/10.3390/mi10090616 |
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