Investigation on the Edge Chipping in Ultrasonic Assisted Sawing of Monocrystalline Silicon

Monocrystalline silicon is an important semiconductor material and occupies a large part of the market demand. However, as a hard-brittle material, monocrystalline silicon is extremely prone to happen edge chipping during sawing processing. The edge chipping seriously affects the quality and perform...

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Detalles Bibliográficos
Autores principales: Shen, Jianyun, Zhu, Xu, Chen, Jianbin, Tao, Ping, Wu, Xian
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6780082/
https://www.ncbi.nlm.nih.gov/pubmed/31527434
http://dx.doi.org/10.3390/mi10090616

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6780082/
https://www.ncbi.nlm.nih.gov/pubmed/31527434
http://dx.doi.org/10.3390/mi10090616

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