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Investigation on the Edge Chipping in Ultrasonic Assisted Sawing of Monocrystalline Silicon
Monocrystalline silicon is an important semiconductor material and occupies a large part of the market demand. However, as a hard-brittle material, monocrystalline silicon is extremely prone to happen edge chipping during sawing processing. The edge chipping seriously affects the quality and perform...
Autores principales: | Shen, Jianyun, Zhu, Xu, Chen, Jianbin, Tao, Ping, Wu, Xian |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2019
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6780082/ https://www.ncbi.nlm.nih.gov/pubmed/31527434 http://dx.doi.org/10.3390/mi10090616 |
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