Fabrication of Simultaneously Implementing “Wired Face-Up and Face-Down Ultrathin Piezoresistive Si Chips” on a Film Substrate by Screen-Offset Printing

We realized the implementation of an ultrathin piezoresistive Si chip and stretchable printed wires on a flexible film substrate using simple screen-offset printing technology. This process does not require a special MEMS fabrication equipment and is applicable to face-up chips where electrodes are...

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Detalles Bibliográficos
Autores principales: Takei, Yusuke, Nomura, Ken-ichi, Horii, Yoshinori, Zymelka, Daniel, Ushijima, Hirobumi, Kobayashi, Takeshi
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6780128/
https://www.ncbi.nlm.nih.gov/pubmed/31454906
http://dx.doi.org/10.3390/mi10090563

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