Reduction of Escherichia Coli Using Metal Plates with the Influenced of Applied Low Current and Physical Barrier of Filter Layers

Although metal contact is known to reduce bacterial growth, the effects of physical barriers and electricity need further investigation. This study examined the bacteria-reducing properties of copper and stainless-steel metal plates with an added electrical current and up to three filter layers on the growth of Escherichia coli (bacteria) and MS2 bacteriophages (virus). When used with a stainless-steel plate, electricity increased bacteria reduction by 39.5 ± 2.30% in comparison with no electricity added, whereas a three-layer physical barrier decreased its efficiency. Copper also reduced the growth of bacteria, by 58.2 ± 8.23%, and the addition of electricity reduced it further (79.5 ± 2.34%). Bacteriophages were also affected by the metal contact. Further experiments showed that MS2 was also reduced by copper, to 82.9 ± 4.5% after 24 h at 37 °C.