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Green Composites of Poly(3-hydroxybutyrate) Containing Graphene Nanoplatelets with Desirable Electrical Conductivity and Oxygen Barrier Properties

[Image: see text] Poly(3-hydroxybutyrate), a green polymer originating from prokaryotic microbes, has been used to prepare composites with graphene nanoplatelets (GnP) at different concentrations. The films were fabricated by drop-casting and were hot-pressed at a temperature lower than their meltin...

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Detalles Bibliográficos
Autores principales: Papadopoulou, Evie L., Basnett, Pooja, Paul, Uttam C., Marras, Sergio, Ceseracciu, Luca, Roy, Ipsita, Athanassiou, Athanassia
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Chemical Society 2019
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6881833/
https://www.ncbi.nlm.nih.gov/pubmed/31788606
http://dx.doi.org/10.1021/acsomega.9b02528
Descripción
Sumario:[Image: see text] Poly(3-hydroxybutyrate), a green polymer originating from prokaryotic microbes, has been used to prepare composites with graphene nanoplatelets (GnP) at different concentrations. The films were fabricated by drop-casting and were hot-pressed at a temperature lower than their melting point to provide the molecular chains enough energy to reorientate while avoiding melting and degradation. It was found that hot-pressing increases crystallinity and improves mechanical properties. The Young’s modulus increased from 1.2 to 1.6 GPa for the poly(3-hydroxybutyrate) (P(3HB)) films and from 0.5 to 2.2 GPa for the 15 wt % P(3HB)/GnP composites. Electrical resistivity decreases enormously with GnP concentration and hot-pressing, reaching 6 Ω sq(–1) for the hot-pressed 30 wt % P(3HB)/GnP composite. Finally, the hot-pressed P(3HB) samples exhibit remarkable oxygen barrier properties, with oxygen permeability reaching 2800 mL μm m(–2) day(–1), which becomes 895 mL μm m(–2) day(–1) when 15% GnP is added to the biopolymer matrix, one of the lowest values known for biopolymers and biocomposites. We propose that these biocomposites are used for elastic packaging and electronics.