Properties of −O–Cu–O– Bridged Copper Phosphate-Based Thermal Insulation Materials

[Image: see text] P–O–H polycondensation −O–Cu–O– ion-bonded bridges were formed in copper phosphate thermal insulation materials by mixing Al(OH)(3) dissolved in H(3)PO(4) with CuO filler and Al(2)O(3), SiC, ZrC, and Cr(2)O(3) as curing accelerators, alone or in combination. The effects of different additive combinations on the curing behavior and thermal stability of the copper phosphate thermal insulation material matrixes were compared using thermogravimetry/differential scanning calorimetry, X-ray diffractometry, and scanning electron microscopy. The copper phosphate materials exhibit good thermal stabilities and low thermal conductivities. The thermal weight losses before and after ceramic reinforcement were 4–19.8 and 3.8–9.4%, respectively, and the thermal conductivities of the P–O–H polycondensation −O–Cu–O– ion-bonded bridges formed in the copper phosphate thermal insulation materials were in the range of 0.656–1.824 W/(m·K).