Properties of −O–Cu–O– Bridged Copper Phosphate-Based Thermal Insulation Materials

[Image: see text] P–O–H polycondensation −O–Cu–O– ion-bonded bridges were formed in copper phosphate thermal insulation materials by mixing Al(OH)(3) dissolved in H(3)PO(4) with CuO filler and Al(2)O(3), SiC, ZrC, and Cr(2)O(3) as curing accelerators, alone or in combination. The effects of differen...

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Detalles Bibliográficos
Autores principales: Zhan, Zizhang, Sun, Wei, Zhang, Zhengyi, Xiong, Xiang, Xu, Yonglong, Zeng, Yi, Yin, Jian
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Chemical Society 2019
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6882121/
https://www.ncbi.nlm.nih.gov/pubmed/31788630
http://dx.doi.org/10.1021/acsomega.9b02914

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6882121/
https://www.ncbi.nlm.nih.gov/pubmed/31788630
http://dx.doi.org/10.1021/acsomega.9b02914

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