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Properties of −O–Cu–O– Bridged Copper Phosphate-Based Thermal Insulation Materials
[Image: see text] P–O–H polycondensation −O–Cu–O– ion-bonded bridges were formed in copper phosphate thermal insulation materials by mixing Al(OH)(3) dissolved in H(3)PO(4) with CuO filler and Al(2)O(3), SiC, ZrC, and Cr(2)O(3) as curing accelerators, alone or in combination. The effects of differen...
| Autores principales: | , , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
American Chemical Society
2019
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6882121/ https://www.ncbi.nlm.nih.gov/pubmed/31788630 http://dx.doi.org/10.1021/acsomega.9b02914 |