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Cutting-based single atomic layer removal mechanism of monocrystalline copper: edge radius effect

The ultimate objective of mechanical cutting is to down minimum chip thickness to single atomic layer. In this study, the cutting-based single atomic layer removal mechanism on monocrystalline copper is investigated by a series of molecular dynamics analysis. The research findings report that when c...

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Detalles Bibliográficos
Autores principales: Xie, Wenkun, Fang, Fengzhou
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Springer US 2019
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6898710/
https://www.ncbi.nlm.nih.gov/pubmed/31811570
http://dx.doi.org/10.1186/s11671-019-3195-4
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author Xie, Wenkun
Fang, Fengzhou
author_facet Xie, Wenkun
Fang, Fengzhou
author_sort Xie, Wenkun
collection PubMed
description The ultimate objective of mechanical cutting is to down minimum chip thickness to single atomic layer. In this study, the cutting-based single atomic layer removal mechanism on monocrystalline copper is investigated by a series of molecular dynamics analysis. The research findings report that when cutting depth decreases to atomic scale, minimum chip thickness could be down to single atomic layer by mechanical cutting using rounded edge tool. The material removal behaviour during cutting-based single atomic layer removal exhibits four characteristics, including chip formation by shearing-stress driven dislocation motion, elastic deformation on the processed surface, atomic sizing effect, and cutting-edge radius effect. Based on this understanding, a new cutting model is proposed to study the material removal behaviour in cutting-based single atomic layer removal process, significantly different from those for nanocutting and conventional cutting. The outcomes provide theoretical support for the research and development of the atomic and close-to-atomic scale manufacturing technology.
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spelling pubmed-68987102019-12-20 Cutting-based single atomic layer removal mechanism of monocrystalline copper: edge radius effect Xie, Wenkun Fang, Fengzhou Nanoscale Res Lett Nano Express The ultimate objective of mechanical cutting is to down minimum chip thickness to single atomic layer. In this study, the cutting-based single atomic layer removal mechanism on monocrystalline copper is investigated by a series of molecular dynamics analysis. The research findings report that when cutting depth decreases to atomic scale, minimum chip thickness could be down to single atomic layer by mechanical cutting using rounded edge tool. The material removal behaviour during cutting-based single atomic layer removal exhibits four characteristics, including chip formation by shearing-stress driven dislocation motion, elastic deformation on the processed surface, atomic sizing effect, and cutting-edge radius effect. Based on this understanding, a new cutting model is proposed to study the material removal behaviour in cutting-based single atomic layer removal process, significantly different from those for nanocutting and conventional cutting. The outcomes provide theoretical support for the research and development of the atomic and close-to-atomic scale manufacturing technology. Springer US 2019-12-06 /pmc/articles/PMC6898710/ /pubmed/31811570 http://dx.doi.org/10.1186/s11671-019-3195-4 Text en © The Author(s). 2019 Open AccessThis article is distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made.
spellingShingle Nano Express
Xie, Wenkun
Fang, Fengzhou
Cutting-based single atomic layer removal mechanism of monocrystalline copper: edge radius effect
title Cutting-based single atomic layer removal mechanism of monocrystalline copper: edge radius effect
title_full Cutting-based single atomic layer removal mechanism of monocrystalline copper: edge radius effect
title_fullStr Cutting-based single atomic layer removal mechanism of monocrystalline copper: edge radius effect
title_full_unstemmed Cutting-based single atomic layer removal mechanism of monocrystalline copper: edge radius effect
title_short Cutting-based single atomic layer removal mechanism of monocrystalline copper: edge radius effect
title_sort cutting-based single atomic layer removal mechanism of monocrystalline copper: edge radius effect
topic Nano Express
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6898710/
https://www.ncbi.nlm.nih.gov/pubmed/31811570
http://dx.doi.org/10.1186/s11671-019-3195-4
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